硅片表面形貌测量VIT系列
NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth, bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile
3DIC TSV and BWS TTV硅片表面形貌测量
Film Stress薄膜应力量测仪
FEOL Electrical Characterization 电学特性
Thin wafer metrology 晶圆测量学
Film Adhesion漆膜附着力测试NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth, bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile
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